Infineon to invest around €1.1 billion in 300 mm GaN power chip production in Villach, Austria
By Eve
Infineon will invest around €1.1 billion by 2034 to establish high-volume gallium nitride (GaN) power semiconductor manufacturing on 300 mm wafers in its existing Villach cleanrooms, with production scheduled to start by the end of 2027 and ramp-up aligned with market demand. The European Commission has approved €319 million in state aid under the European Chips Act, with Austria's Federal Ministry for Economic Affairs, Energy and Tourism to provide it once its formal funding commitment follows. Infineon says a 300 mm wafer yields 2.3 times as many chips as a 200 mm wafer, and that it processed the world's first 300 mm GaN wafers in September 2024.
Why it matters
GaN is cited for more efficient switching and conversion, with smaller, lower heat systems across applications including e-mobility and energy infrastructure, so larger European volume could shape future power electronics supply for charging hardware. Buyers and CPOs should note the 2027 start date and demand-led ramp when planning component sourcing, as the article gives no pricing or capacity figures.
Source
- Original title
- “Infineon to set up high-volume 300 mm GaN power chip production in Austria”
- Published
- 4 November 2026
- Updated
- 5 November 2026
In this story
- Topic
- EV Charging
- Tag
- Infineon
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